Invention Grant
- Patent Title: Printing circuit board accommodation casing having engagement protrusion with crushing margin
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Application No.: US15873500Application Date: 2018-01-17
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Publication No.: US10561032B2Publication Date: 2020-02-11
- Inventor: Akitsugu Funahashi , Takeshi Tsuriki , Takahiro Suga
- Applicant: AISIN SEIKI KABUSHIKI KAISHA
- Applicant Address: JP Kariya-Shi, Aichi-Ken
- Assignee: AISIN SEIKI KABUSHIKI KAISHA
- Current Assignee: AISIN SEIKI KABUSHIKI KAISHA
- Current Assignee Address: JP Kariya-Shi, Aichi-Ken
- Agency: Buchanan Ingersoll & Rooney PC
- Priority: JP2017-007864 20170119
- Main IPC: H05K5/00
- IPC: H05K5/00 ; H05K5/02 ; H05K5/04 ; H05K7/14
Abstract:
A printed circuit board accommodation casing includes: a support surface that abuts on a first planar portion of a printed circuit board; a side wall portion located outside in a planar direction of the printed circuit board, the first planar portion of which is abutted by the support surface; and an engagement protrusion formed on the side wall portion, in which a crushing margin, which is crushed against the first planar portion of the printed circuit board, is set on the engagement protrusion at a location where the support surface does not abut on the first planar portion of the printed circuit board.
Public/Granted literature
- US20180206348A1 PRINTED CIRCUIT BOARD ACCOMMODATION CASING Public/Granted day:2018-07-19
Information query
