Invention Grant
- Patent Title: Flexible gasket seal for direct liquid cooling of electronic devices
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Application No.: US16154710Application Date: 2018-10-08
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Publication No.: US10561040B1Publication Date: 2020-02-11
- Inventor: Harvey Lunsman , Tahir Cader , Michael Scott
- Applicant: Hewlett Packard Enterprise Development LP
- Applicant Address: US TX Houston
- Assignee: Hewlett Packard Enterprise Development LP
- Current Assignee: Hewlett Packard Enterprise Development LP
- Current Assignee Address: US TX Houston
- Agency: Sheppard Mullin Richter & Hampton LLP
- Main IPC: H05K7/20
- IPC: H05K7/20 ; G06F1/20

Abstract:
Systems and methods are provided for a gasket that allows for a single cooling cold plate to touch one or more devices. These devices may have precise but varying thermal interfaces and mounting pressure requirements; and height and co-planarity tolerances that need to be accommodated. The gasket may be sandwiched in between a top stiffener plate and a floating cold plate along an outer perimeter of the gasket; and a rigid, cold plate base and a bottom stiffener plate along an inner perimeter of the gasket. The resulting seal allows coolant to flow between the rigid and floating cold plates as these plates move (i.e., float) with respect to one another. Thus, the gasket aids in a cooling apparatus achieve an optimum thermal interface with each of the one or more devices simultaneously, while accounting for the individual tolerance variations across each device.
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