Invention Grant
- Patent Title: Titanium thermal module
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Application No.: US16137471Application Date: 2018-09-20
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Publication No.: US10561041B2Publication Date: 2020-02-11
- Inventor: Payam Bozorgi
- Applicant: PiMEMS, Inc.
- Applicant Address: US CA Pleasanton
- Assignee: PiMEMS, Inc.
- Current Assignee: PiMEMS, Inc.
- Current Assignee Address: US CA Pleasanton
- Agent Jaquelin K. Spong
- Main IPC: H05K7/20
- IPC: H05K7/20 ; C01G23/047 ; F28D15/02 ; F28D15/04 ; F28F21/08 ; B82Y30/00

Abstract:
The present application discloses two-phase cooling devices that may include at least three substrates: a metal with a wicking structure, an intermediate substrate and a backplane. The titanium thermal module may be adapted for use in a mobile device, such as a portable device or smartphone, where it may offer compelling performance advantages. The thermal module may also have a metal layer which may act as a shield for radiation or an antenna for radiation, or may add mechanical strength to the thermal module.
Public/Granted literature
- US20190116691A1 TITANIUM THERMAL MODULE Public/Granted day:2019-04-18
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