A seal for an International Protection (IP)-sealing and electromagnetic capability (EMC)-shielding connection between a first housing component and a second housing component of an electrical or electronic device is disclosed. The seal includes an elastomer-containing sealing body and a metallic support that is embedded to some extent in the sealing body. The sealing body and the metallic support are connected to one another in an adhesive and/or form-fitting manner and thus form a material bond, and the metallic support has a plurality of contact segments, which project out of the sealing body and are configured such that the contact segments make electrical contact in resilient fashion with a first boundary surface that is assigned to the first housing component, and a second boundary surface that is assigned to the second housing component, the seal being pressed in between said boundary surfaces in an installed state.