Invention Grant
- Patent Title: Ultrasound transducer and method for wafer level back face attachment
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Application No.: US15385671Application Date: 2016-12-20
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Publication No.: US10561398B2Publication Date: 2020-02-18
- Inventor: Flavien Daloz , Jason Barrett , Edouard Da Cruz , Jean Pierre Malacrida
- Applicant: General Electric Company
- Applicant Address: US NY Schenectady
- Assignee: General Electric Company
- Current Assignee: General Electric Company
- Current Assignee Address: US NY Schenectady
- Agency: McCoy Russell LLP
- Main IPC: H01L41/09
- IPC: H01L41/09 ; A61B8/00 ; B06B1/06 ; H01L41/313 ; H01L41/08 ; H01L41/338

Abstract:
Methods and systems are provided for a single element ultrasound transducer. In one embodiment, the ultrasound transducer comprises a front face, a back face parallel to the front face, a piezoelectric layer having a top surface electrically coupled to the signal pad and a bottom surface electrically coupled to the ground pad. In this way, the transducer can work robustly and may be automatically mounted to an imaging probe.
Public/Granted literature
- US20180175278A1 ULTRASOUND TRANSDUCER AND METHOD FOR WAFER LEVEL BACK FACE ATTACHMENT Public/Granted day:2018-06-21
Information query
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