Invention Grant
- Patent Title: Electronic component
-
Application No.: US15719419Application Date: 2017-09-28
-
Publication No.: US10566129B2Publication Date: 2020-02-18
- Inventor: Masuo Yatabe , Chitose Kimura , Kozue Imaizumi , Ichiro Yokoyama
- Applicant: TAIYO YUDEN CO., LTD.
- Applicant Address: JP Tokyo
- Assignee: TAIYO YUDEN CO., LTD.
- Current Assignee: TAIYO YUDEN CO., LTD.
- Current Assignee Address: JP Tokyo
- Agency: Law Office of Katsuhiro Arai
- Priority: JP2016-193271 20160930; JP2017-151115 20170803
- Main IPC: H01F27/28
- IPC: H01F27/28 ; H01F27/29

Abstract:
In an embodiment, an electronic component includes: an element body part 10 constituted by an insulative body of rectangular solid shape; an internal conductor 30 provided inside the element body part 10; and external electrodes 50 provided at least on the bottom face 14 (mounting surface) of the element body part 10 and electrically connected to the internal conductor 30; wherein the element body part 10 has: a conductor-containing layer 20 in which a coil conductor 36 (functional part) that will become a part of the internal conductor 30 to demonstrate electrical performance, is provided; and a high-hardness layer 22 which is provided side by side with the conductor-containing layer 20 in a direction parallel with the bottom face 14 (mounting surface) of the element body part 10, and which has a higher hardness compared to the conductor-containing layer 20. The electronic component has improve mechanical strength.
Public/Granted literature
- US20180096778A1 ELECTRONIC COMPONENT Public/Granted day:2018-04-05
Information query