Invention Grant
- Patent Title: Coil component and method of manufacturing same
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Application No.: US16548147Application Date: 2019-08-22
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Publication No.: US10566130B2Publication Date: 2020-02-18
- Inventor: Kang Wook Bong , Boum Seock Kim , Jae Hun Kim , Jong Sik Yoon , Byeong Cheol Moon
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-si, Gyeonggi-do
- Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee Address: KR Suwon-si, Gyeonggi-do
- Agency: Morgan, Lewis & Bockius LLP
- Priority: KR10-2016-0089438 20160714
- Main IPC: H01F5/00
- IPC: H01F5/00 ; H01F27/28 ; H01F27/255 ; H01F27/32 ; H01F41/04 ; H01F27/29
Abstract:
A coil component includes an insulating layer having a coil shape, first and second coil conductor layers on opposing surfaces of the insulating layer, each having a coil shape corresponding to that of the insulating layer, and an encapsulant encapsulating the insulating layer and the first and second coil conductor layers.
Public/Granted literature
- US20190378644A1 COIL COMPONENT AND METHOD OF MANUFACTURING SAME Public/Granted day:2019-12-12
Information query
