Invention Grant
- Patent Title: Controlling method for a wafer transportation part and a load port part on an EFEM
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Application No.: US15373210Application Date: 2016-12-08
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Publication No.: US10566227B2Publication Date: 2020-02-18
- Inventor: Tsutomu Okabe , Hidetoshi Horibe
- Applicant: TDK CORPORATION
- Applicant Address: JP Tokyo
- Assignee: TDK CORPORATION
- Current Assignee: TDK CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Oliff PLC
- Priority: JP2015-242040 20151211
- Main IPC: H01L21/677
- IPC: H01L21/677 ; H01L21/673 ; H01L21/67 ; H01L21/02

Abstract:
A controlling method for a wafer transportation part and a load port part on an EFEM includes a fixing step of fixing a container on an installation stand of the load port part, a first cleaning step of connecting a bottom nozzle of the load port part to multiple bottom holes formed on a bottom surface of the container and introducing a cleaning gas into the container and discharging a gas from the container via the nozzle, a connection step of connecting the container and the transportation room, and a wafer transportation step of transporting the wafer from the container to a processing room via the opening and the transportation room and transporting the wafer from the processing room to the container via the transportation room and the opening.
Public/Granted literature
- US20170170044A1 CONTROLING METHOD FOR A WAFER TRANSPORTATION PART AND A LOAD PORT PART ON AN EFEM Public/Granted day:2017-06-15
Information query
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