Invention Grant
- Patent Title: Overlay-correction method and a control system using the same
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Application No.: US15860801Application Date: 2018-01-03
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Publication No.: US10566252B2Publication Date: 2020-02-18
- Inventor: Seungyoon Lee , Chan Hwang
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si, Gyeonggi-do
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si, Gyeonggi-do
- Agency: F. Chau & Associates, LLC
- Priority: KR10-2017-0060157 20170515
- Main IPC: H01L21/66
- IPC: H01L21/66 ; G03F9/00 ; G03F7/20 ; G03F1/00

Abstract:
A method of correcting an overlay includes: forming a first pattern on a first substrate; forming a second pattern on the first pattern; obtaining a first overlay error profile of the second pattern and obtaining a first overlay correction profile from the first overlay error profile; forming a third pattern on the second pattern; obtaining a second overlay error profile of the third pattern and obtaining a second overlay correction profile from the second overlay error profile; and forming the second pattern on a second substrate, wherein the forming of the second pattern on the second substrate includes: determining whether the second overlay correction profile has a non-correctable model parameter; and when the second overlay correction profile has the non-correctable model, obtaining a preliminary correction profile to correct a position of the second pattern to be formed on the second substrate.
Public/Granted literature
- US20180330999A1 OVERLAY-CORRECTION METHOD AND A CONTROL SYSTEM USING THE SAME Public/Granted day:2018-11-15
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