Invention Grant
- Patent Title: Flow path member and semiconductor module
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Application No.: US16062112Application Date: 2016-12-16
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Publication No.: US10566264B2Publication Date: 2020-02-18
- Inventor: Yuusaku Ishimine , Takeshi Muneishi , Kazuhiko Fujio , Yoshiyuki Fukuda , Kentaro Takanami , Takao Shirai
- Applicant: KYOCERA CORPORATION , TOSHIBA MATERIALS CO., LTD.
- Applicant Address: JP Kyoto-shi, Kyoto JP Yokohama-shi, Kanagawa
- Assignee: KYOCERA CORPORATION,TOSHIBA MATERIALS CO., LTD.
- Current Assignee: KYOCERA CORPORATION,TOSHIBA MATERIALS CO., LTD.
- Current Assignee Address: JP Kyoto-shi, Kyoto JP Yokohama-shi, Kanagawa
- Agency: Viering Jentschura & Partner MBB
- Priority: JP2015-248039 20151218
- International Application: PCT/JP2016/087641 WO 20161216
- International Announcement: WO2017/104830 WO 20170622
- Main IPC: H01L23/00
- IPC: H01L23/00 ; H01L23/473 ; C04B35/587 ; F28F13/02 ; H01L23/36 ; H05K7/20

Abstract:
A flow path member may include silicon nitride ceramics. The flow path member may have an inlet port, an outlet port, and a flow path connected to the inlet port and the outlet port inside the flow path member. A plurality of needle-shaped crystals may be arranged on a surface of the flow path where the needle-shaped crystals intersect each other.
Public/Granted literature
- US20180374778A1 FLOW PATH MEMBER AND SEMICONDUCTOR MODULE Public/Granted day:2018-12-27
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