Invention Grant
- Patent Title: Low stress integrated circuit package
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Application No.: US15845777Application Date: 2017-12-18
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Publication No.: US10566269B2Publication Date: 2020-02-18
- Inventor: Makoto Shibuya
- Applicant: Texas Instruments Incorporated
- Applicant Address: US TX Dallas
- Assignee: TEXAS INSTRUMENTS INCORPORATED
- Current Assignee: TEXAS INSTRUMENTS INCORPORATED
- Current Assignee Address: US TX Dallas
- Agent Dawn Jos; Charles A. Brill; Frank D. Cimino
- Main IPC: H01L23/495
- IPC: H01L23/495 ; H01L23/31 ; H01L23/00 ; H01L23/29 ; H01L21/48 ; H01L21/56
Abstract:
In a described example, an integrated circuit (IC) package includes: an IC chip bonded to a chip mount pad on a lead frame; low modulus molding compound surrounding the IC chip; and IC package molding compound covering the IC chip, and at least a portion of the low modulus molding compound.
Public/Granted literature
- US20190189543A1 LOW STRESS INTEGRATED CIRCUIT PACKAGE Public/Granted day:2019-06-20
Information query
IPC分类:
