Invention Grant
- Patent Title: Array substrate and manufacturing method thereof
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Application No.: US15749127Application Date: 2018-01-04
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Publication No.: US10566352B2Publication Date: 2020-02-18
- Inventor: Hui Xia
- Applicant: Shenzhen China Star Optoelectronics Semiconductor Display Technology Co., Ltd.
- Applicant Address: CN Guangdong
- Assignee: Shenzhen China Star Optoelectronics Semiconductor Display Technology Co., Ltd.
- Current Assignee: Shenzhen China Star Optoelectronics Semiconductor Display Technology Co., Ltd.
- Current Assignee Address: CN Guangdong
- Agent Mark M. Friedman
- Priority: CN201711283181 20171207
- International Application: PCT/CN2018/071229 WO 20180104
- International Announcement: WO2019/109443 WO 20190613
- Main IPC: H01L27/12
- IPC: H01L27/12 ; H01L51/00 ; H01L27/32
Abstract:
A method of manufacturing an array substrate is provided. The method divides an array substrate into a curing area and a stretchable area. A metal wiring corresponding to the stretchable area is made of a flexible conductive material, so as to reduce disconnection risk of the display panel during bending.
Public/Granted literature
- US20190181154A1 ARRAY SUBSTRATE AND MANUFACTURING METHOD THEREOF Public/Granted day:2019-06-13
Information query
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