Invention Grant
- Patent Title: Semiconductor device and a manufacturing method thereof
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Application No.: US15900383Application Date: 2018-02-20
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Publication No.: US10566367B2Publication Date: 2020-02-18
- Inventor: Yotaro Goto , Takeshi Kamino , Fumitoshi Takahashi
- Applicant: Renesas Electronics Corporation
- Applicant Address: JP Tokyo
- Assignee: RENESAS ELECTRONICS CORPORATION
- Current Assignee: RENESAS ELECTRONICS CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: McDermott Will & Emery LLP
- Priority: JP2017-085425 20170424
- Main IPC: H01L27/146
- IPC: H01L27/146

Abstract:
The performances of a semiconductor device are improved. A semiconductor device has a transfer transistor and a photodiode. The photodiode has an n type semiconductor region, an n+ type semiconductor region, and a second p type semiconductor region surrounded by a first p type semiconductor region of an interpixel isolation region. The n+ type semiconductor region is formed on the main surface side of the semiconductor substrate, and the n type semiconductor region is formed under the n+ type semiconductor region via the second p type semiconductor region. In the channel length direction of the transfer transistor, in the n type semiconductor region, an n−− type semiconductor region having a lower impurity density than that of the n type semiconductor region is arranged, to improve the transfer efficiency of electric charges accumulated in the photodiode.
Public/Granted literature
- US20180308884A1 SEMICONDUCTOR DEVICE AND A MANUFACTURING METHOD THEREOF Public/Granted day:2018-10-25
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