Invention Grant
- Patent Title: Three-dimensional vertical memory
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Application No.: US16137512Application Date: 2018-09-20
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Publication No.: US10566388B2Publication Date: 2020-02-18
- Inventor: Guobiao Zhang
- Applicant: Guobiao Zhang
- Applicant Address: CN HangZhou, ZheJiang US OR Corvalis
- Assignee: HangZhou HaiCun Information Technology Co., Ltd.,Guobiao Zhang
- Current Assignee: HangZhou HaiCun Information Technology Co., Ltd.,Guobiao Zhang
- Current Assignee Address: CN HangZhou, ZheJiang US OR Corvalis
- Priority: CN201810518263 20180527; CN201810537891 20180530; CN201810542880 20180530; CN201810619764 20180614; CN201810674263 20180626
- Main IPC: H01L27/24
- IPC: H01L27/24 ; H01L23/528 ; H01L27/112 ; H01L27/22 ; H01L23/525 ; H01L45/00 ; H01L43/02 ; H01L43/12

Abstract:
In a shared three-dimensional vertical memory (3D-MV), each horizontal address line comprises at least two regions: a lightly-doped region and a low-resistivity region. The lightly-doped region is formed around selected memory holes and shared by a plurality of low-leakage memory cells. The low-resistivity region forms a conductive network to reduce the resistance of the horizontal address line.
Public/Granted literature
- US20190363132A1 Three-Dimensional Vertical Memory Public/Granted day:2019-11-28
Information query
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