Invention Grant
- Patent Title: Apparatus for high speed printing of semiconductor devices
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Application No.: US15870529Application Date: 2018-01-12
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Publication No.: US10566507B2Publication Date: 2020-02-18
- Inventor: Cody Peterson
- Applicant: Rohinni, LLC
- Applicant Address: US ID Coeur d'Alene
- Assignee: Rohinini, LLC
- Current Assignee: Rohinini, LLC
- Current Assignee Address: US ID Coeur d'Alene
- Agency: Lee & Hayes, P.C.
- Main IPC: H01L33/56
- IPC: H01L33/56 ; H01L21/67 ; G03G15/043 ; H01L33/62 ; H01L21/68
Abstract:
A device for depositing an unpackaged semiconductor die (“die”) onto a substrate. The device includes a developing unit adjacent to a drum. The developing unit has wrapped thereon a diced semiconductor wafer including at least one die. The developing unit is configured to move laterally in a direction of a longitudinal axis of the developing unit to transfer the at least one die to the drum.
Public/Granted literature
- US20180198041A1 Apparatus For High Speed Printing of Semiconductor Devices Public/Granted day:2018-07-12
Information query
IPC分类:
