Invention Grant
- Patent Title: Thermoelectric module
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Application No.: US15908719Application Date: 2018-02-28
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Publication No.: US10566514B2Publication Date: 2020-02-18
- Inventor: Gook Hyun Ha , Ji Hun Yu , Gil Gun Lee
- Applicant: KOREA INSTITUTE OF MACHINERY & MATERIALS
- Applicant Address: KR Daejeon-si
- Assignee: Korea Institute of Machinery & Materials
- Current Assignee: Korea Institute of Machinery & Materials
- Current Assignee Address: KR Daejeon-si
- Agency: Lewis Roca Rothgerber Christie LLP
- Priority: KR10-2007-00037285 20070417
- Main IPC: H01L35/32
- IPC: H01L35/32 ; H01L35/34

Abstract:
Provided is a thermoelectric module including electrodes and P-type and N-type semiconductors formed on a substrate by a printing method. The thermoelectric module includes upper and lower substrates (110 and 120) formed of ceramic or aluminum and forming upper and lower surfaces of the thermoelectric module; electrodes (130) disposed on surfaces of the upper and lower substrates (110 and 120), the electrodes being formed of an electrically conductive material for transmitting electric power; a plurality of P-type and N-type semiconductors (140 and 150) spaced between the electrodes (130), the P-type and N-type semiconductors (140 and 150) being forming by sintering a paste mixture of thermoelectric powder and an organic solvent, wherein the electrodes (130) and the P-type and N-type semiconductors (140 and 150) are formed by a printing method. With this configuration, thin thermoelectric module having various sizes and shapes can be provided.
Public/Granted literature
- US20180190893A1 Thermoelectric Module Public/Granted day:2018-07-05
Information query
IPC分类: