Invention Grant
- Patent Title: Stacked memory package incorporating millimeter wave antenna in die stack
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Application No.: US16021463Application Date: 2018-06-28
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Publication No.: US10566686B2Publication Date: 2020-02-18
- Inventor: John F. Kaeding , Owen R. Fay
- Applicant: Micron Technology, Inc.
- Applicant Address: US ID Boise
- Assignee: MICRON TECHNOLOGY, INC.
- Current Assignee: MICRON TECHNOLOGY, INC.
- Current Assignee Address: US ID Boise
- Agency: Parsons Behle & Latimer
- Main IPC: H01Q21/00
- IPC: H01Q21/00 ; H01Q1/38 ; H01L23/66 ; H01L23/00 ; H01L25/065 ; H01L21/768 ; H01L25/00 ; H01Q1/22 ; H01Q1/24 ; H01L23/48
Abstract:
A stacked semiconductor device assembly may include a first semiconductor device having a first substrate and a first set of vias through the first substrate. The first set of vias may define a first portion of an antenna structure. The stacked semiconductor device assembly may further include a second semiconductor device having a second substrate and a second set of vias through the second substrate. The second set of vias may define a second portion of the antenna structure. The stacked semiconductor device assembly may also include a stack interconnect structure electrically coupling the first portion of the antenna structure to the second portion of the antenna.
Public/Granted literature
- US20200006845A1 STACKED MEMORY PACKAGE INCORPORATING MILLIMETER WAVE ANTENNA IN DIE STACK Public/Granted day:2020-01-02
Information query
