Invention Grant
- Patent Title: Resin substrate, component-mounted resin substrate, and method of manufacturing component-mounted resin substrate
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Application No.: US15791449Application Date: 2017-10-24
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Publication No.: US10568209B2Publication Date: 2020-02-18
- Inventor: Kuniaki Yosui
- Applicant: Murata Manufacturing Co., Ltd.
- Applicant Address: JP Kyoto
- Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee Address: JP Kyoto
- Agency: Keating & Bennett, LLP
- Priority: JP2015-139734 20150713
- Main IPC: H05K1/18
- IPC: H05K1/18 ; H05K1/11 ; H05K3/34 ; H05K1/03 ; H05K3/00 ; H05K3/40 ; H05K3/46

Abstract:
A resin substrate includes a base portion including one first resin sheet made of a thermoplastic resin as a main material or a stack of two or more first resin sheets each made of a thermoplastic resin as a main material, the base portion including a main surface, and first and second connecting conductors provided on the main surface of the base portion and spaced away from each other. The base portion includes a convex portion separating the first and second connecting conductors on the main surface by a second resin sheet disposed at a position on a surface of the base portion or inside the base portion. The second resin sheet is made of the same material as the first resin sheet.
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