The present invention enables the manufacture of a small-sized high-density multi-layer printed circuit board. The manufacturing method for a multi-layer printed circuit board, according to the present invention, comprises: a step in which an electrical insulation layer is formed by heating a laminate comprising a substrate, a heat-curable resin composition layer provided on the substrate, and a release substrate provided on the heat-curable resin composition layer, thereby curing the heat-curable resin composition layer, and a step in which a via hole is formed in the electrical insulation layer by irradiating a laser from above the release substrate. In addition, in the present invention, the release substrate has a thickness of at least 80 μm and is formed using a material having a glass transition temperature, the heat-curable resin composition layer has a volatile component-content of 7.0 mass % or less and a thickness of 25 μm or less, and the curing of the heat-curable resin composition layer occurs at a temperature that is not less than the glass transition temperature of the material of the release substrate.