Invention Grant
- Patent Title: Multilayered transient liquid phase bonding
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Application No.: US14815098Application Date: 2015-07-31
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Publication No.: US10568213B2Publication Date: 2020-02-18
- Inventor: Bradley Paul Barber
- Applicant: SKYWORKS SOLUTIONS, INC.
- Applicant Address: US MA Woburn
- Assignee: SKYWORKS SOLUTIONS, INC.
- Current Assignee: SKYWORKS SOLUTIONS, INC.
- Current Assignee Address: US MA Woburn
- Agency: Lando & Anastasi, LLP
- Main IPC: H05K3/10
- IPC: H05K3/10 ; C23C28/02 ; B32B15/01 ; H01L21/321 ; H05K1/11 ; H05K1/18
Abstract:
A bonding structure includes a first layer of first alloy component disposed on a substrate and a first layer of a second alloy component disposed on the first alloy component. The second alloy component has a lower melting temperature than the first alloy component. A second layer of the first alloy component is disposed on the first layer of the second alloy component and a second layer of the second alloy component is disposed on the second layer of the first alloy component.
Public/Granted literature
- US20160037649A1 MULTILAYERED TRANSIENT LIQUID PHASE BONDING Public/Granted day:2016-02-04
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