Invention Grant
- Patent Title: Thermally conductive substrate article
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Application No.: US14391459Application Date: 2013-03-07
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Publication No.: US10568233B2Publication Date: 2020-02-18
- Inventor: Rui Yang , Hui Luo , Carl E. Fisher
- Applicant: 3M INNOVATIVE PROPERTIES COMPANY
- Applicant Address: US MN St. Paul
- Assignee: 3M INNOVATIVE PROPERTIES COMPANY
- Current Assignee: 3M INNOVATIVE PROPERTIES COMPANY
- Current Assignee Address: US MN St. Paul
- Agent Clifton F. Richardson
- International Application: PCT/US2013/029571 WO 20130307
- International Announcement: WO2014/003835 WO 20140103
- Main IPC: H05K7/20
- IPC: H05K7/20 ; B32B27/38 ; B32B15/14 ; B32B5/02
Abstract:
A thermally conductive article including a polymeric layer comprising a nonwoven polymeric material. In particular, a flexible thermally conductive polymeric layer comprising an epoxy resin and a long-strand polymeric nonwoven material embedded in the epoxy resin. The polymeric nonwoven material may be heat stable at about 280 C.
Public/Granted literature
- US20150111021A1 THERMALLY CONDUCTIVE SUBSTRATE ARTICLE Public/Granted day:2015-04-23
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