Invention Grant
- Patent Title: Cutter device for processing difficult-to-machine material
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Application No.: US16065758Application Date: 2016-12-21
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Publication No.: US10576556B2Publication Date: 2020-03-03
- Inventor: Kwang Soo Park , Sook Hwan Kim
- Applicant: POSCO , RESEARCH INSTITUTE OF INDUSTRIAL SCIENCE & TECHNOLOGY
- Applicant Address: KR Pohang-si, Gyeongsangbuk-do KR Pohang-si, Gyeongsangbuk-do
- Assignee: POSCO,Research Institute of Industrial Science and Technology
- Current Assignee: POSCO,Research Institute of Industrial Science and Technology
- Current Assignee Address: KR Pohang-si, Gyeongsangbuk-do KR Pohang-si, Gyeongsangbuk-do
- Agency: Morgan, Lewis & Bockius LLP
- Priority: KR10-2015-0185434 20151223
- International Application: PCT/KR2016/015041 WO 20161221
- International Announcement: WO2017/111474 WO 20170629
- Main IPC: B23C5/00
- IPC: B23C5/00 ; B23C5/24

Abstract:
Provided is a cutter apparatus for machining a difficult-to-machine material, the cutter apparatus including: a cutting tool body which has a fastening portion formed at a center thereof; one or more cutters which are installed on the cutting tool body, and have superhard insert tips fixed to end portions thereof, respectively; and an angle adjusting unit which is installed in an internal space of the cutters, and adjusts angles of the cutters by spreading or retracting the cutters, so that angles of the cutters may be easily adjusted in accordance with a condition for cutting a difficult-to-machine material, in order to prevent damage to the superhard insert tips when machining a difficult-to-machine material having high hardness and high toughness.
Public/Granted literature
- US20190009350A1 CUTTER DEVICE FOR PROCESSING DIFFICULT-TO-MACHINE MATERIAL Public/Granted day:2019-01-10
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