Invention Grant
- Patent Title: Solder paste misprint cleaning
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Application No.: US15173751Application Date: 2016-06-06
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Publication No.: US10576566B2Publication Date: 2020-03-03
- Inventor: Xingquan Dong , Yanlong Hou , LiCen Mu , Ben Wu , WeiFeng Zhang
- Applicant: International Business Machines Corporation
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agent Isaac J. Gooshaw
- Main IPC: B23K1/00
- IPC: B23K1/00 ; B23K3/00 ; B23K35/00 ; H05K3/00 ; B23K1/018 ; B23K3/04 ; B23K3/08 ; B23K35/26 ; B23K35/30 ; B23K35/36 ; B23K35/02 ; H05K3/22 ; H05K3/34 ; B23K31/02 ; B23K31/12

Abstract:
A processor receives solder paste information, where the solder paste information describes a solder paste used in assembly of a printed circuit board. A processor determines a minimum magnetic force required for removing the solder paste from the printed circuit board based on the solder paste information. A processor receives electromagnet information, where the electromagnet information describes an electromagnet used in cleaning of a misprint of the solder paste on the printed circuit board. A processor determines a minimum amount of power to provide the electromagnet to induce the minimum magnetic force in the electromagnet, where the determination of the amount of power is based on the electromagnet information and the minimum magnetic force. A processor adjusts an amount of power applied to the electromagnet to at least the determined minimum amount of power to clean the misprint of the solder paste from the printed circuit board.
Public/Granted literature
- US20170348784A1 SOLDER PASTE MISPRINT CLEANING Public/Granted day:2017-12-07
Information query
IPC分类: