Invention Grant
- Patent Title: Laser processing machine and laser processing method
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Application No.: US16093048Application Date: 2017-04-13
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Publication No.: US10576584B2Publication Date: 2020-03-03
- Inventor: Akihiko Sugiyama , Yuya Mizoguchi , Masahito Ito , Masato Kunihiro
- Applicant: AMADA HOLDINGS CO., LTD.
- Applicant Address: JP Kanagawa
- Assignee: AMADA HOLDINGS CO., LTD.
- Current Assignee: AMADA HOLDINGS CO., LTD.
- Current Assignee Address: JP Kanagawa
- Agency: Greenblum & Bernstein, P.L.C.
- Priority: JP2016-081539 20160414; JP2017-077515 20170410
- International Application: PCT/JP2017/015073 WO 20170413
- International Announcement: WO2017/179642 WO 20171019
- Main IPC: B23K26/38
- IPC: B23K26/38 ; B23K26/064 ; B23K26/00 ; B23K103/10 ; B23K101/18

Abstract:
A period of time during which a laser beam moves through an inner region of a beam spot that ranges from a center of the beam spot to an area corresponding to a thermal energy of 44% with respect to a total thermal energy of the beam spot is set as a moving time tp. “c”, “ρ”, “λ”, “T”, “T0”, “A”, and “Pd” respectively represents a specific heat, a density, a thermal conductivity, a melting temperature, an environmental temperature, a light absorptance, and an energy density of the inner region. A time calculated from Equation (1) is set as a melting time tm. A plate thickness is represented by x and a value of tm/tp is represented by y. The value y is set between a lower limit value (Equation (2)) and an upper limit value (Equation (3)). tm=c×ρ×λ×π[(T−T0)/(2×A×Pd)]2 (1) y=0.0027e0.36x (2) y=0.0026e0.4512x (3)
Public/Granted literature
- US20190118304A1 LASER PROCESSING MACHINE AND LASER PROCESSING METHOD Public/Granted day:2019-04-25
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