Invention Grant
- Patent Title: Method of cutting brittle material, device for cutting brittle material, method of manufacturing cut brittle material and cut brittle material
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Application No.: US15540408Application Date: 2016-01-22
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Publication No.: US10576651B2Publication Date: 2020-03-03
- Inventor: Hiroyuki Tamon , Hideaki Oota , Naoya Hayakawa
- Applicant: Central Glass Company, Ltd.
- Applicant Address: JP Ube
- Assignee: Central Glass Co., Ltd.
- Current Assignee: Central Glass Co., Ltd.
- Current Assignee Address: JP Ube
- Agency: Crowell & Moring LLP
- Priority: JP2015-019022 20150203; JP2015-053507 20150317
- International Application: PCT/JP2016/051876 WO 20160122
- International Announcement: WO2016/125609 WO 20160811
- Main IPC: B26F3/16
- IPC: B26F3/16 ; B28D1/22 ; C03B33/09 ; B28D7/02

Abstract:
Provided are a method of full body cutting a brittle material without via the bend-breaking step, an apparatus of cutting a brittle material, a method of manufacturing a brittle material, and a cut brittle material. A method of cutting a brittle material, the method comprising: a conveyance cutting step of converging and irradiating an infrared ray to the brittle material linearly along a line using an infrared line heater while moving the infrared line heater relative to the brittle material in a direction along the line, thereby cutting the brittle material along the line.
Public/Granted literature
Information query
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