Invention Grant
- Patent Title: Polyphenylene sulfide resin composition and hollow forming products using the same
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Application No.: US16310318Application Date: 2017-06-23
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Publication No.: US10577501B2Publication Date: 2020-03-03
- Inventor: Yuji Yamanaka , Kei Saito , Hiroyuki Isago , Takeshi Unohara , Hideki Matsumoto
- Applicant: TORAY INDUSTRIES, INC.
- Applicant Address: JP Tokyo
- Assignee: Toray Industries, Inc.
- Current Assignee: Toray Industries, Inc.
- Current Assignee Address: JP Tokyo
- Agency: DLA Piper LLP (US)
- Priority: JP2016-128611 20160629; JP2016-148385 20160728; JP2017-036302 20170228
- International Application: PCT/JP2017/023232 WO 20170623
- International Announcement: WO2018/003700 WO 20180104
- Main IPC: C08L81/02
- IPC: C08L81/02 ; C08L77/00 ; C08L101/06 ; F02M35/10

Abstract:
A polyphenylene sulfide resin composition includes a polyphenylene sulfide resin (A), an amino group-containing compound (B), an epoxy group-containing elastomer (C), wherein the polyphenylene sulfide resin (A) forms a continuous phase and the amino group-containing compound (B) and the epoxy group-containing elastomer (C) form a dispersed phase in the morphology of a forming product composed of the resin composition observed with a transmission electron microscope, and the modulus of elongation (the elastic modulus determined by performing a tensile test on an ASTM type 1 dumbbell test piece obtained by injection molding at a cylinder temperature of 300° C. and at a mold temperature of 150° C., under the conditions in which the distance between chucks is 114 mm, the test piece distance is 100 mm, and the elongation rate is 10 mm/min) of the resin composition is 1.0 MPa or more and 1000 MPa or less.
Public/Granted literature
- US20190330470A1 POLYPHENYLENE SULFIDE RESIN COMPOSITION AND HOLLOW FORMING PRODUCTS USING THE SAME Public/Granted day:2019-10-31
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