Invention Grant
- Patent Title: Copper etchant composition
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Application No.: US15387456Application Date: 2016-12-21
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Publication No.: US10577696B2Publication Date: 2020-03-03
- Inventor: Seul Ki Kim , Se Hoon Kim
- Applicant: ENF TECHNOLOGY CO., LTD.
- Applicant Address: KR Gyeonggi-do
- Assignee: ENF Technology CO., LTD.
- Current Assignee: ENF Technology CO., LTD.
- Current Assignee Address: KR Gyeonggi-do
- Agency: McCoy Russell LLP
- Priority: KR10-2015-0183740 20151222
- Main IPC: C23F1/00
- IPC: C23F1/00 ; C23F1/02 ; C23F1/10 ; C23F1/14 ; C23F1/16 ; C23F1/18 ; C23F1/44 ; C23F1/46 ; C23F4/00 ; H01L21/04 ; H01L21/306 ; H01L21/3213 ; H01L21/768
Abstract:
Provided is a copper etchant composition including: a first organic acid containing one or more amine groups, and one or more carboxylic acid groups; a second organic acid; an amine compound; hydrogen peroxide; and a phosphate compound, which has the increased number of processing sheets and etching uniformity, when etching copper.
Public/Granted literature
- US20170175274A1 COPPER ETCHANT COMPOSITION Public/Granted day:2017-06-22
Information query
