Invention Grant
- Patent Title: Whipstock/bottom hole assembly interconnection and method
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Application No.: US15414276Application Date: 2017-01-24
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Publication No.: US10577882B2Publication Date: 2020-03-03
- Inventor: Ewoud Hulsewe
- Applicant: Ewoud Hulsewe
- Applicant Address: US TX Houston
- Assignee: BAKER HUGHES, A GE COMPANY, LLC
- Current Assignee: BAKER HUGHES, A GE COMPANY, LLC
- Current Assignee Address: US TX Houston
- Agency: Cantor Colburn LLP
- Main IPC: E21B29/06
- IPC: E21B29/06 ; E21B7/06

Abstract:
A whipstock interconnection body including a whipstock interface, a bottom hole assembly (BHA) interface, the BHA interface including a feature configured to inherently grip the BHA. A whipstock interconnection body including a whipstock interface, a bottom hole assembly (BHA) interface, the BHA interface configured for attachment to a back surface of the whipstock. A whipstock/BHA assembly including a whipstock, a BHA, a whipstock interconnection body releasably securing the whipstock to the BHA, the whipstock interconnection body including a whipstock interface, a bottom hole assembly (BHA) interface, the BHA interface including a feature configured to inherently grip the BHA. A whipstock/BHA assembly including a whipstock, a BHA, a whipstock interconnection body releasably securing the whipstock to the BHA, the whipstock interconnection body including a whipstock interface, a bottom hole assembly (BHA) interface, the BHA interface configured for attachment to a back surface of the whipstock.
Public/Granted literature
- US20180209233A1 WHIPSTOCK/BOTTOM HOLE ASSEMBLY INTERCONNECTION AND METHOD Public/Granted day:2018-07-26
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