Invention Grant
- Patent Title: Camera skid
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Application No.: US15533338Application Date: 2015-11-10
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Publication No.: US10578856B2Publication Date: 2020-03-03
- Inventor: Wei Yong , Richard Jordan
- Applicant: Metrotech Corporation , Wei Yong
- Applicant Address: US CA Santa Clara
- Assignee: Metrotech Corporation
- Current Assignee: Metrotech Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Haynes and Boone, LLP
- International Application: PCT/CN2015/094196 WO 20151110
- International Announcement: WO2017/079896 WO 20170518
- Main IPC: G02B23/24
- IPC: G02B23/24 ; G01N21/954 ; H04N5/225
Abstract:
In some embodiments, a camera skid is presented. The camera skid includes a body into which a camera can be inserted; and a front portion received into the body, the front portion including a lip that contacts a face of the camera.
Public/Granted literature
- US20170371145A1 CAMERA SKID Public/Granted day:2017-12-28
Information query
