Invention Grant
- Patent Title: Method and apparatus of repairing transistor
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Application No.: US15848654Application Date: 2017-12-20
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Publication No.: US10578937B2Publication Date: 2020-03-03
- Inventor: Chung-Kuang Chien
- Applicant: HKC Corporation Limited , Chongqing HKC Optoelectronics Technology Co., ltd.
- Applicant Address: CN Shenzhen CN Chongqing
- Assignee: HKC CORPORATION LIMITED,CHONGQING HKC OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Current Assignee: HKC CORPORATION LIMITED,CHONGQING HKC OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Current Assignee Address: CN Shenzhen CN Chongqing
- Agency: WPAT, PC
- Priority: CN201611193990 20161221
- Main IPC: H01L21/00
- IPC: H01L21/00 ; G02F1/1362 ; H01L29/786 ; H01L29/66 ; G09G3/36

Abstract:
A method of repairing a transistor, for repairing a short-circuit defect of a metal layer between a source and a drain of a thin film transistor; the repairing method including: acquiring a short-circuit region of the metal layer between the source and the drain of the thin film transistor; etching a protective layer located above the short-circuit region with a first wavelength laser; etching the metal layer located in the short-circuit region with a second wavelength laser; and partially etching a channel layer below the short-circuit region with a third wavelength laser.
Public/Granted literature
- US20180173065A1 METHOD AND APPARATUS OF REPAIRING TRANSISTOR Public/Granted day:2018-06-21
Information query
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