Invention Grant
- Patent Title: Conductive sheet
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Application No.: US16031032Application Date: 2018-07-10
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Publication No.: US10579094B2Publication Date: 2020-03-03
- Inventor: Daisuke Kuroda
- Applicant: DEXERIALS CORPORATION
- Applicant Address: JP Tokyo
- Assignee: DEXERIALS CORPORATION
- Current Assignee: DEXERIALS CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Oliff PLC
- Priority: JP2012-204506 20120918
- Main IPC: G06F1/16
- IPC: G06F1/16 ; B32B15/06 ; C09J7/29 ; G02B5/20 ; G06F3/041 ; B32B15/08 ; C09J9/02 ; B32B15/082 ; B32B15/085 ; B32B15/088 ; B32B15/09 ; B32B15/092 ; B32B15/095 ; B32B15/20 ; B32B25/12 ; B32B25/16 ; B32B25/20 ; B32B27/08 ; B32B27/20 ; B32B27/28 ; B32B27/30 ; B32B27/32 ; B32B27/34 ; B32B27/36 ; B32B27/38

Abstract:
A conductive sheet has a structure in which a conductive adhesive layer laminated on one side of a base substrate and a light-shielding insulating layer laminated on another side of the base substrate. The base substrate has a structure in which the same kind of metal layers are formed on respective sides of a resin film. The light-shielding insulating layer of the conductive sheet has a surface having a surface resistivity of 1.0×108 Ω/square or more, a gloss value of 80% or less, and an optical density of 1 or more.
Public/Granted literature
- US20180314290A1 CONDUCTIVE SHEET Public/Granted day:2018-11-01
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