Invention Grant
- Patent Title: Data distribution fabric in scalable GPUs
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Application No.: US16417899Application Date: 2019-05-21
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Publication No.: US10580109B2Publication Date: 2020-03-03
- Inventor: Altug Koker , Lakshminarayanan Striramassarma , Akif Ali
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Jaffery Watson Mendonsa & Hamilton LLP
- Main IPC: G06T1/20
- IPC: G06T1/20 ; G06T1/60 ; G06F15/08 ; G06T11/00 ; G06T15/00 ; G06T15/80 ; H04L12/933

Abstract:
One embodiment provides for a processor comprising a three-dimensional (3D) integrated circuit stack including multiple graphics processor cores and interconnect logic to interconnect the graphics processor cores of the 3D integrated circuit stack to enable data distribution between the graphics processor cores over a virtual channel including multiple programmatically pre-assigned traffic classifications.
Public/Granted literature
- US20190272615A1 DATA DISTRIBUTION FABRIC IN SCALABLE GPUS Public/Granted day:2019-09-05
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