Invention Grant
- Patent Title: Coil component
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Application No.: US15183099Application Date: 2016-06-15
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Publication No.: US10580563B2Publication Date: 2020-03-03
- Inventor: Dong Jin Jeong
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-si, Gyeonggi-Do
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon-si, Gyeonggi-Do
- Agency: Morgan, Lewis & Bockius LLP
- Priority: KR10-2015-0149165 20151027
- Main IPC: H01F5/00
- IPC: H01F5/00 ; H01F27/255 ; H01F1/36 ; H01F17/00 ; H01F17/04 ; H01F27/29 ; H01F1/26
Abstract:
A coil component includes: a coil part; and a body formed around the coil part and containing a magnetic material. The body contains a first magnetic powder particle having a first insulating film formed on a surface thereof, and a second magnetic powder particle having a second insulating film formed on a surface thereof, and an average thickness of the first insulating film is thicker than that of the second insulating film.
Public/Granted literature
- US20170117082A1 COIL COMPONENT Public/Granted day:2017-04-27
Information query
