Invention Grant
- Patent Title: Method for manufacturing package structure having elastic bump
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Application No.: US16203634Application Date: 2018-11-29
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Publication No.: US10580665B2Publication Date: 2020-03-03
- Inventor: Po-Chun Lin
- Applicant: NANYA TECHNOLOGY CORPORATION
- Applicant Address: TW New Taipei
- Assignee: NANYA TECHNOLOGY CORPORATION
- Current Assignee: NANYA TECHNOLOGY CORPORATION
- Current Assignee Address: TW New Taipei
- Agency: CKC & Partners Co., LLC
- Main IPC: H01L21/56
- IPC: H01L21/56 ; H01L23/00 ; H01L23/31
Abstract:
A package structure includes an interconnection layer; a passivation layer disposed on the interconnection layer, in which the interconnection layer and the passivation layer defined at least one opening; at least one elastic bump disposed on the interconnection layer, in which a portion of the elastic bump is embedded in the opening; and a conductive layer disposed on the elastic bump.
Public/Granted literature
- US20190096797A1 PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF Public/Granted day:2019-03-28
Information query
IPC分类:
