Invention Grant
- Patent Title: Semiconductor device
-
Application No.: US16137250Application Date: 2018-09-20
-
Publication No.: US10580744B1Publication Date: 2020-03-03
- Inventor: Hsih-Yang Chiu
- Applicant: NANYA TECHNOLOGY CORPORATION
- Applicant Address: TW New Taipei
- Assignee: NANYA TECHNOLOGY CORPORATION
- Current Assignee: NANYA TECHNOLOGY CORPORATION
- Current Assignee Address: TW New Taipei
- Agency: Muncy, Geissler, Olds & Lowe, P.C.
- Main IPC: H01L23/52
- IPC: H01L23/52 ; H01L23/58
Abstract:
The present disclosure provides a semiconductor device. The semiconductor device includes a semiconductor substrate, a die and a seal ring. The die is configured to be in and on the semiconductor substrate. The seal ring is configured to be on the semiconductor substrate and adjacent to the die. The seal ring forms an open loop.
Public/Granted literature
- US20200098706A1 SEMICONDUCTOR DEVICE Public/Granted day:2020-03-26
Information query
IPC分类:
