Invention Grant
- Patent Title: Multi-fin FINFET device including epitaxial growth barrier on outside surfaces of outermost fins and related methods
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Application No.: US16049685Application Date: 2018-07-30
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Publication No.: US10580771B2Publication Date: 2020-03-03
- Inventor: Qing Liu , Prasanna Khare , Nicolas Loubet
- Applicant: STMICROELECTRONICS, INC.
- Applicant Address: US TX Coppell
- Assignee: STMICROELECTRONICS, INC.
- Current Assignee: STMICROELECTRONICS, INC.
- Current Assignee Address: US TX Coppell
- Agency: Seed IP Law Group LLP
- Main IPC: H01L21/84
- IPC: H01L21/84 ; H01L29/66 ; H01L29/78 ; H01L21/8238 ; H01L27/088 ; H01L29/08 ; H01L21/265 ; H01L29/417 ; H01L21/225 ; H01L21/8234

Abstract:
A multi-fin FINFET device may include a substrate and a plurality of semiconductor fins extending upwardly from the substrate and being spaced apart along the substrate. Each semiconductor fin may have opposing first and second ends and a medial portion therebetween, and outermost fins of the plurality of semiconductor fins may comprise an epitaxial growth barrier on outside surfaces thereof. The FINFET may further include at least one gate overlying the medial portions of the semiconductor fins, a plurality of raised epitaxial semiconductor source regions between the semiconductor fins adjacent the first ends thereof, and a plurality of raised epitaxial semiconductor drain regions between the semiconductor fins adjacent the second ends thereof.
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Information query
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