Invention Grant
- Patent Title: Variable thickness gate oxide transcap
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Application No.: US15947667Application Date: 2018-04-06
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Publication No.: US10580908B2Publication Date: 2020-03-03
- Inventor: Xia Li , Bin Yang , Gengming Tao
- Applicant: QUALCOMM Incorporated
- Applicant Address: US CA San Diego
- Assignee: QUALCOMM Incorporated
- Current Assignee: QUALCOMM Incorporated
- Current Assignee Address: US CA San Diego
- Agency: Patterson & Sheridan, L.L.P.
- Main IPC: H01L29/93
- IPC: H01L29/93 ; H01L27/08 ; H01L29/06 ; H01G7/06 ; H01L29/739 ; H01L29/94

Abstract:
Aspects of the present disclosure provide semiconductor variable capacitor devices. In one embodiment, a semiconductor variable capacitor includes a gate oxide layer comprising a first layer portion with a first thickness and a second layer portion with a second thickness; a first non-insulative region disposed above the gate oxide layer; a first semiconductor region disposed beneath the gate oxide layer; a second semiconductor region disposed beneath the gate oxide layer and adjacent to the first semiconductor region, wherein the second semiconductor region comprises a different doping type than the first semiconductor region a second non-insulative region coupled to the first semiconductor region; and a control terminal coupled to a control region coupled to the second semiconductor region such that a first capacitance between the first non-insulative region and the second non-insulative region is configured to be adjusted by varying a control voltage applied to the control region.
Public/Granted literature
- US20190312153A1 VARIABLE THICKNESS GATE OXIDE TRANSCAP Public/Granted day:2019-10-10
Information query
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