Invention Grant
- Patent Title: Light emitting module
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Application No.: US15269021Application Date: 2016-09-19
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Publication No.: US10580949B2Publication Date: 2020-03-03
- Inventor: Keiichi Maki
- Applicant: TOSHIBA HOKUTO ELECTRONICS CORPORATION
- Applicant Address: JP Asahikawa-Shi
- Assignee: Toshiba Hokuto Electronics Corporation
- Current Assignee: Toshiba Hokuto Electronics Corporation
- Current Assignee Address: JP Asahikawa-Shi
- Agency: Burr & Brown, PLLC
- Priority: JP2014-196381 20140926
- Main IPC: H01L33/62
- IPC: H01L33/62 ; H01L33/44 ; H01L33/38 ; H01L27/15 ; H01L25/075

Abstract:
A light emitting module according to an embodiment includes a first insulation film and a second insulation film with a light transmissivity, a plurality of first double-sided light emitting elements disposed between the first insulation film and the second insulation film, and each including a pair of electrodes on one surface, a plurality of second double-sided light emitting elements disposed between the first insulation film and the second insulation film adjacent to the respective first double-sided light emitting elements, each including a pair of electrodes on one surface, and emitting different light from the first double-sided light emitting element.
Public/Granted literature
- US20170005247A1 LIGHT EMITTING MODULE Public/Granted day:2017-01-05
Information query
IPC分类: