Invention Grant
- Patent Title: Method for providing chip-to-chip wireless communication and electronic device thereof
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Application No.: US15391159Application Date: 2016-12-27
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Publication No.: US10581535B2Publication Date: 2020-03-03
- Inventor: Jae-Sung Rieh , Daekeun Yoon , Jungsoo Kim
- Applicant: Samsung Electronics Co., Ltd. , Korea University Research and Business Foundation
- Applicant Address: KR Suwon-si KR Seoul
- Assignee: Samsung Electronics Co., Ltd.,Korea University Research and Business Foundation
- Current Assignee: Samsung Electronics Co., Ltd.,Korea University Research and Business Foundation
- Current Assignee Address: KR Suwon-si KR Seoul
- Agency: Jefferson IP Law, LLP
- Priority: KR10-2016-0003803 20160112
- Main IPC: H04B15/02
- IPC: H04B15/02 ; H04B7/24
Abstract:
A device and a method for reducing an influence of interference between signals using an aperture array in chip-to-chip wireless communication are provided. The device includes a transmitter including at least one transmission antenna for transmitting a signal, a receiver including at least one reception antenna for receiving the signal, a guide structure including at least one opening for guiding a path of the signal, and the at least one transmission antenna, the at least one reception antenna, and the at least one opening are arranged to correspond to one another.
Public/Granted literature
- US20170201333A1 METHOD FOR PROVIDING CHIP-TO-CHIP WIRELESS COMMUNICATION AND ELECTRONIC DEVICE THEREOF Public/Granted day:2017-07-13
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