Invention Grant
- Patent Title: Metadata-based application and infrastructure deployment
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Application No.: US15586923Application Date: 2017-05-04
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Publication No.: US10581675B1Publication Date: 2020-03-03
- Inventor: Balaji Thiagarajan Iyer
- Applicant: Amazon Technologies, Inc.
- Applicant Address: US WA Seattle
- Assignee: Amazon Technologies, Inc.
- Current Assignee: Amazon Technologies, Inc.
- Current Assignee Address: US WA Seattle
- Agency: Lowenstein Sandler LLP
- Main IPC: H04L29/06
- IPC: H04L29/06 ; H04L12/24 ; H04L29/08 ; G06F8/60 ; G06F8/41

Abstract:
A system for deploying an application using an infrastructure identified based on metadata associated with source code of the application. The system extracts code metadata during compile time and build time of the application source code. Application configuration parameters are identified from the metadata and matched to an application configuration pattern selected from multiple application configuration patterns stored in a repository. A learning process is applied wherein feedback data is used to create new application configuration patterns and update existing patterns. An infrastructure script is generated using infrastructure parameters identified using the selected application configuration pattern. The infrastructure script is executed to provision an infrastructure for deployment of the application.
Information query