Invention Grant
- Patent Title: Printed circuit board (PCB) mount for headphone earcup
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Application No.: US15726764Application Date: 2017-10-06
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Publication No.: US10582292B2Publication Date: 2020-03-03
- Inventor: Daniel P. Baker , Christopher A Barnes
- Applicant: Bose Corporation
- Applicant Address: US MA Framingham
- Assignee: BOSE CORPORATION
- Current Assignee: BOSE CORPORATION
- Current Assignee Address: US MA Framingham
- Agency: Hoffman Warnick LLC
- Main IPC: H04R1/10
- IPC: H04R1/10 ; H04R5/033 ; G06F3/044

Abstract:
Various implementations include printed circuit board mounts and related headphone systems employing such mounts. In one implementation, a mount for a printed circuit board (PCB) includes: a plate for matingly engaging an inner portion of a headphone earcup, the plate including at least one PCB mount for coupling with the PCB; and a coupling element extending from the plate and including at least one coupler for coupling the plate proximate to a spine extending through the inner portion of the headphone earcup.
Public/Granted literature
- US20190110123A1 PRINTED CIRCUIT BOARD (PCB) MOUNT FOR HEADPHONE EARCUP Public/Granted day:2019-04-11
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