Invention Grant
- Patent Title: Heating coil
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Application No.: US13705981Application Date: 2012-12-05
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Publication No.: US10582575B2Publication Date: 2020-03-03
- Inventor: Yutaka Kiyosawa , Yutaka Sugiyama , Yasuharu Ogawa
- Applicant: NETUREN CO., LTD.
- Applicant Address: JP Tokyo
- Assignee: NETUREN CO., LTD.
- Current Assignee: NETUREN CO., LTD.
- Current Assignee Address: JP Tokyo
- Agency: Wenderoth, Lind & Ponack, L.L.P.
- Priority: JP2011-266331 20111205; JP2012-201434 20120913
- Main IPC: H05B6/36
- IPC: H05B6/36 ; C21D1/42 ; H05B6/42 ; H05B6/38

Abstract:
A heating coil includes a pair of linear lead portions adapted to be connected to a power supply, and a ring-shaped or coil-shaped head portion having end portions connected to the lead portions respectively. A flow path through which a cooling medium flows is formed inside the lead portions and the head portion. An outer circumferential surface of the head portion has a circular or elliptical cross section and is configured to face a heating target portion of an inner circumferential surface of a work extending, the heating target portion extending in a circumferential direction of the work. Each of the lead portions has a straight side portion in a plane intersecting a longitudinal direction of the lead portions, the straight side portions of the lead portions being arranged in proximity to each other.
Public/Granted literature
- US20130140299A1 HEATING COIL Public/Granted day:2013-06-06
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