Invention Grant
- Patent Title: Liquid cooling distribution in a modular electronic system
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Application No.: US16131629Application Date: 2018-09-14
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Publication No.: US10582639B1Publication Date: 2020-03-03
- Inventor: Rakesh Chopra , Mandy Hin Lam , M. Baris Dogruoz
- Applicant: CISCO TECHNOLOGY, INC.
- Applicant Address: US CA San Jose
- Assignee: CISCO TECHNOLOGY, INC.
- Current Assignee: CISCO TECHNOLOGY, INC.
- Current Assignee Address: US CA San Jose
- Agent Cindy Kaplan
- Main IPC: H05K7/20
- IPC: H05K7/20 ; H05K7/02

Abstract:
In one embodiment, an apparatus includes a chassis comprising a plurality of slots for receiving a plurality of modules, a first group of the modules received in a first orientation and a second group of the modules received in a second orientation orthogonal to said first orientation, and a coolant distribution module inserted into one of the slots in the first orientation for distributing coolant to at least one of the modules in the second group of modules. A method for distributing coolant to the modules is also disclosed herein.
Public/Granted literature
- US20200093031A1 LIQUID COOLING DISTRIBUTION IN A MODULAR ELECTRONIC SYSTEM Public/Granted day:2020-03-19
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