Invention Grant
- Patent Title: Implants for bridging osseous defects
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Application No.: US15901221Application Date: 2018-02-21
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Publication No.: US10582956B2Publication Date: 2020-03-10
- Inventor: William Scott Van Dyke , Frank A Liporace , Dan Dziadosz , Jordan Grossman , Jordi Asuncion Marquez , Paul Thomas Slagle , George J Haidukewych , David Thordarson
- Applicant: Biomet Manufacturing, LLC
- Applicant Address: US IN Warsaw
- Assignee: Biomet Manufacturing, LLC
- Current Assignee: Biomet Manufacturing, LLC
- Current Assignee Address: US IN Warsaw
- Agency: Schwegman Lundberg & Woessner, P.A.
- Main IPC: A61B17/72
- IPC: A61B17/72 ; A61F2/28 ; A61F2/42 ; A61F2/30

Abstract:
Various modular implants and modular implant systems are disclosed herein, as are methods of implanting the same. The modular implant systems can include modular implants that are stacked on each other to define a modular implant system, which in an example can be used to replace or augment a void in bone. The modular implants can interact with an intramedullary implant to, for instance, assist with a fusion procedure.
Public/Granted literature
- US10716603B2 Implants for bridging osseous defects Public/Granted day:2020-07-21
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