- Patent Title: Three-dimensional laminating and shaping apparatus, three-dimensional lamenting and shaping apparatus control method, and three-dimensional laminating and shaping apparatus control program
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Application No.: US15122836Application Date: 2016-03-25
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Publication No.: US10583517B2Publication Date: 2020-03-10
- Inventor: Shinichi Kitamura , Hironobu Manabe
- Applicant: TECHNOLOGY RESEARCH ASSOCIATION FOR FUTURE ADDITIVE MANUFACTURING
- Applicant Address: JP Tokyo
- Assignee: TECHNOLOGY RESEARCH ASSOCIATION FOR FUTURE ADDITIVE MANUFACTURING
- Current Assignee: TECHNOLOGY RESEARCH ASSOCIATION FOR FUTURE ADDITIVE MANUFACTURING
- Current Assignee Address: JP Tokyo
- Agency: Ladas & Parry LLP
- International Application: PCT/JP2016/059644 WO 20160325
- International Announcement: WO2017/163404 WO 20170928
- Main IPC: B23K15/00
- IPC: B23K15/00 ; B33Y30/00 ; B33Y40/00 ; B22F3/105 ; B33Y10/00 ; B33Y50/02

Abstract:
This invention effectively suppresses the generation of scattered electrons such as secondary electrons and backscattered electrons. A three-dimensional laminating and shaping apparatus includes a linear funnel that recoats a material of a three-dimensional laminated and shaped object onto a shaping surface on which the three-dimensional laminated and shaped object is to be shaped. The three-dimensional laminating and shaping apparatus also includes an electron gun that generates an electron beam. The three-dimensional laminating and shaping apparatus further includes an anti-deposition cover made of a metal and formed between the shaping surface and the electron gun. In addition, the three-dimensional laminating and shaping apparatus includes a DC power supply that applies a positive voltage to the anti-deposition cover.
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