Invention Grant
- Patent Title: Resin-molded component
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Application No.: US16115856Application Date: 2018-08-29
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Publication No.: US10583597B2Publication Date: 2020-03-10
- Inventor: Hiroya Ito , Takatoshi Inoue , Tsukasa Ishiwata
- Applicant: KOITO MANUFACTURING CO., LTD.
- Applicant Address: JP Minato-ku, Tokyo
- Assignee: KOITO MANUFACTURING CO., LTD.
- Current Assignee: KOITO MANUFACTURING CO., LTD.
- Current Assignee Address: JP Minato-ku, Tokyo
- Agency: Sughrue Mion, PLLC
- Priority: JP2015-235858 20151202
- Main IPC: B29C45/16
- IPC: B29C45/16 ; F21S41/20 ; B29K67/00 ; B29K59/00 ; B29L31/30 ; B32B3/02 ; B32B27/08 ; B29C45/33 ; B29L31/00 ; B29C45/14

Abstract:
A resin-molded component includes a first molding part, and a second molding part. A portion of the first molding part and a portion of the second molding part are laminated in a direction of connecting an outer surface and an inner surface of the resin-molded component to provide a laminated portion. A portion of the second molding part is provided as an exposed portion. Each of portions of the laminated portion is located at least on opposite sides across the exposed portion. A one-side surface of the exposed portion in the laminating direction of the laminated portion is configured as a portion of the outer surface and the other-side surface thereof is configured as a portion of the inner surface.
Public/Granted literature
- US20190016029A1 RESIN-MOLDED COMPONENT Public/Granted day:2019-01-17
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