A lamination molding apparatus, including a chamber covering a molding region; a powder layer forming apparatus to form a material powder layer by discharging the material powder onto the molding region and planarizing the material powder on the molding region; a laser beam emitter to emit a laser beam for sintering the material powder to form a sintered body; a cutting machine to cut the sintered body; a horizontal drive device to move both the cutting machine and the powder layer forming apparatus in a horizontal direction parallel to the molding region; a first vertical drive device to reciprocate the cutting machine in a vertical direction orthogonal to the horizontal direction; and a second vertical drive device to reciprocate the powder layer forming apparatus in the vertical direction, is provided.