Invention Grant
- Patent Title: Photosensitive resin composition
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Application No.: US15557623Application Date: 2016-03-18
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Publication No.: US10584205B2Publication Date: 2020-03-10
- Inventor: Yu Shoji , Yuki Masuda , Yutaro Koyama , Ryoji Okuda
- Applicant: TORAY Industries, Inc.
- Applicant Address: JP Tokyo
- Assignee: TORAY INDUSTRIES, INC.
- Current Assignee: TORAY INDUSTRIES, INC.
- Current Assignee Address: JP Tokyo
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Priority: JP2015-060465 20150324
- International Application: PCT/JP2016/058763 WO 20160318
- International Announcement: WO2016/152794 WO 20160929
- Main IPC: C08K5/39
- IPC: C08K5/39 ; C08G69/26 ; G03F7/023 ; G03F7/20 ; C08K5/38 ; C08L79/02 ; H01L21/02
Abstract:
A highly sensitive photosensitive resin composition that can afford a cured film having a low stressfulness, a high degree of elongation, and an excellent adhesion to a metal material, copper among others, is provided. A photosensitive resin composition including an alkali-soluble resin having an organic group derived from an aliphatic diamine.
Public/Granted literature
- US20180066107A1 PHOTOSENSITIVE RESIN COMPOSITION Public/Granted day:2018-03-08
Information query
