Invention Grant
- Patent Title: CMP compositions containing polymer complexes and agents for STI applications
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Application No.: US15920813Application Date: 2018-03-14
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Publication No.: US10584266B2Publication Date: 2020-03-10
- Inventor: Sarah Brosnan
- Applicant: Cabot Microelectronics Corporation
- Applicant Address: US IL Aurora
- Assignee: Cabot Microelectronics Corporation
- Current Assignee: Cabot Microelectronics Corporation
- Current Assignee Address: US IL Aurora
- Agent Thomas Omholt; Erika S. Wilson; Derek W. Barnett
- Main IPC: C09G1/02
- IPC: C09G1/02 ; B24B37/04 ; H01L21/3105 ; H01L21/306 ; H01L21/762
Abstract:
The invention relates to a chemical-mechanical polishing composition comprising (a) ceria abrasive particles, (b) a cationic polymer, (c) a nonionic polymer comprising polyethylene glycol octadecyl ether, polyethylene glycol lauryl ether, polyethylene glycol oleyl ether, poly(ethylene)-co-poly(ethylene glycol), octylphenoxy poly(ethyleneoxy)ethanol, or a combination thereof, (d) a saturated monoacid, and (e) an aqueous carrier. The invention also relates to a method of polishing a substrate.
Public/Granted literature
- US20190284434A1 CMP COMPOSITIONS CONTAINING POLYMER COMPLEXES AND AGENTS FOR STI APPLICATIONS Public/Granted day:2019-09-19
Information query
