Invention Grant
- Patent Title: Low application temperature hot melt adhesive composition and a method including the same
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Application No.: US15816789Application Date: 2017-11-17
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Publication No.: US10584267B2Publication Date: 2020-03-10
- Inventor: Richard B. Sergeant , Thomas F. Kauffman
- Applicant: H.B. Fuller Company
- Applicant Address: US MN St. Paul
- Assignee: H.B.Fuller Company
- Current Assignee: H.B.Fuller Company
- Current Assignee Address: US MN St. Paul
- Agent Kirsten Stone; Daniel Barta
- Main IPC: C09J123/08
- IPC: C09J123/08 ; C09J7/35 ; B29C65/48 ; C09J5/06 ; C09J193/04 ; C09J11/06 ; C09J11/08
Abstract:
The invention features a hot melt adhesive composition that can be applied at temperatures as low as 107° C., while maintaining excellent bonding under stress and a very fast setting time.
Public/Granted literature
- US20180134927A1 LOW APPLICATION TEMPERATURE HOT MELT ADHESIVE COMPOSITION AND A METHOD INCLUDING THE SAME Public/Granted day:2018-05-17
Information query
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